{"id":37,"date":"2024-07-30T08:00:00","date_gmt":"2024-07-30T07:00:00","guid":{"rendered":"https:\/\/gauthamravisrinivas.com\/?page_id=37"},"modified":"2024-07-31T02:32:49","modified_gmt":"2024-07-31T01:32:49","slug":"publications","status":"publish","type":"page","link":"https:\/\/gauthamravisrinivas.com\/index.php\/publications\/","title":{"rendered":"Publications"},"content":{"rendered":"\n<ol>\n<li class=\"has-medium-font-size\"><strong>Maximum Laser Mark Depth Specification Limits Tightening using Design of Experiments (DOE) for Laser Mark Machines, Singapore, <\/strong>September 2023\n<ul>\n<li>Micron 29th Singapore Technical Backend Seminar<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li class=\"has-medium-font-size\"><strong>Qualification and Proliferation of 11.5X13S8X19 RevC JEDEC Trays or High Volume Manufacturing, Singapore <\/strong>September 2022\n<ul>\n<li>Micron 28th Singapore Technical Backend Seminar<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li class=\"has-medium-font-size\"><strong>Qualification and Implementation of Out of Pocket (OOP) Sensors for Laser Mark Machines, Singapore<\/strong>, September 2021\n<ul>\n<li>Micron 27th Singapore Technical Backend Seminar<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li class=\"has-medium-font-size\"><strong>Qualification of Cyber Technology (CT350) as a Tool on Record (TOR) for Maximum Laser Mark Depth Measurement, Singapore<\/strong>, September 2021\n<ul>\n<li>Micron 27th Singapore Technical Backend Seminar<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li class=\"has-medium-font-size\"><strong>Predictive Maintenance System Using Machine Learning Algorithm for Laser Marking Diode, Singapore, <\/strong>September 2020\n<ul>\n<li>Micron 26th Singapore Technical Backend Seminar<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li class=\"has-medium-font-size\"><strong>Qualification and Implementation of Molecular Sieve desiccants as a packing material for semiconductor devices, Singapore<\/strong>, August 2018\n<ul>\n<li>Micron 24th Singapore Technical Backend Seminar<\/li>\n<\/ul>\n<\/li>\n\n\n\n<li class=\"has-medium-font-size\"><strong>Novel texturing method to remove amorphous silicon on diamond wire saw silicon wafers, Amsterdam<\/strong>, September 2014\n<ul>\n<li>29th European Photovoltaic Solar Energy Conference and Exhibition (EUPVSEC)<\/li>\n<\/ul>\n<\/li>\n<\/ol>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"om_disable_all_campaigns":false,"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0},"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/gauthamravisrinivas.com\/index.php\/wp-json\/wp\/v2\/pages\/37"}],"collection":[{"href":"https:\/\/gauthamravisrinivas.com\/index.php\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/gauthamravisrinivas.com\/index.php\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/gauthamravisrinivas.com\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/gauthamravisrinivas.com\/index.php\/wp-json\/wp\/v2\/comments?post=37"}],"version-history":[{"count":4,"href":"https:\/\/gauthamravisrinivas.com\/index.php\/wp-json\/wp\/v2\/pages\/37\/revisions"}],"predecessor-version":[{"id":78,"href":"https:\/\/gauthamravisrinivas.com\/index.php\/wp-json\/wp\/v2\/pages\/37\/revisions\/78"}],"wp:attachment":[{"href":"https:\/\/gauthamravisrinivas.com\/index.php\/wp-json\/wp\/v2\/media?parent=37"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}